| Type | Frequency range | Size | Information | ||
|
HC3225M4 |
10.0 ~ 54.0MHz | 3.2 x 2.5 x 0.7 |
|
seam sealed ceramic/metal package extended temperature ranges available high mechanical reliability type available for automotive type, see automotive datasheet |
|
HC532M4 |
8.0 ~ 56.0MHz | 5.0 x 3.2 x 1.0 |
|
seam sealed ceramic/metal package extended temperature ranges available high mechanical reliability type available for automotive type, see automotive datasheet |
|
HC-49/USM6 |
3.2768 ~ 40.0MHz | 11.34 x 5.0x 5.0 |
|
reflow soldering temperature: 260 °C max. package height 5 mm |
|
HC-49/USM |
3.2768 ~ 40.0MHz | 11.4 x 4.7 x 4.0 |
|
low cost SMD type reflow soldering temperature: 260 °C max. package height 4.2 mm max. |
|
HC-49/USM(2H) |
3.2768 ~ 40.0MHz | 11.4 x 4.7 x 3.0 |
|
for automotive type, see automotive datasheet extended temperature ranges available reflow soldering temperature: 260 °C max. |
|
HC-49/USM7 |
3.2768 ~ 40.0MHz | 12.9 x 4.73 x 5.0 |
|
reflow soldering temperature: 260 °C max. package height 5 mm |
|
MG3A |
3.50~48MHz | 13.1 x 5.0 x 5.0 |
|
automotive temperature range available reflow soldering temperature: 260 °C max. suitable for automotive applications |
|
HC252M4 |
12.0 ~ 54.0MHz | 2.5 x 2.0 x 0.55 |
|
10 ppm type available EMI shielding possible by grounded lid reflow soldering temperature: 260 °C max. ceramic / metal package |
|
HC7550M4 |
5.53 ~ 170.0MHz | 7.0 x 5.0 x 1.2 |
|
± 10 ppm type available EMI shielding possible by grounded lid reflow soldering temperature: 260 °C max. ceramic / metal package |
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