| Type | Frequency range | Size | Information | ||
|
HO750 |
1.0 ~ 170.0MHz (3.3V) | 7.0 x 5.0 x 1.4 |
|
reflow soldering temperature: 260 °C max. ceramic/metal package |
|
HO750 |
0.5 ~ 160.0MHz (1.8V) | 7.0 x 5.0 x 1.4 |
|
reflow soldering temperature: 260 °C max. ceramic/metal package |
|
HO532 |
0.5 ~ 125.0MHz (1.8V) | 5.0 x 3.2 x 1.4 |
|
high temperature version available reflow soldering temperature: 260 °C max. ceramic/metal package |
|
HO750 |
1.8 ~ 107.0MHz (5.0V) | 7.0 x 5.0 x 1.4 |
|
reflow soldering temperature: 260 °C max. ceramic/metal package |
|
HO532 |
0.5 ~ 125.0MHz (3.3V) | 5.0 x 3.2 x 1.4 |
|
reflow soldering temperature: 260 °C max. ceramic/metal package |
|
HO3225 |
0.75 ~ 80.0MHz (1.8V) | 3.2 x 2.5 x 1.0 |
|
reflow soldering temperature: 260 °C max. compact & flat ceramic/metal package |
|
HO532 |
0.5~ 110.0MHz (5.0V) | 5.0 x 3.2 x 1.4 |
|
reflow soldering temperature: 260 °C max. ceramic/metal package |
|
HO3225 |
0.75 ~ 135.0MHz (3.3) | 3.2 x 2.5 x 1.05 |
|
reflow soldering temperature: 260 °C max. compact & flat ceramic/metal package |
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